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Seal properties of medical packaging materials at elevated temperature

Biomedical Sciences Research Institute Computer Science Research Institute Environmental Sciences Research Institute Nanotechnology & Advanced Materials Research Institute

Dixon, D, McIlhagger, AT, Crangle, AA, Mcilhagger, R and Mccracken, K (2007) Seal properties of medical packaging materials at elevated temperature. Journal of Adhesion Science and Technology, 21 (15). pp. 1529-1537. [Journal article]

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Abstract

This paper proposes a novel measurement method for investigating the high-temperature peel properties of medical packaging materials. Samples were attached to a temperature-controlled aluminium block fitted to a tensile testing machine allowing the temperature dependence of peel strength to be investigated. The mechanical performance of the seals at elevated temperatures is critical. Medical packaging materials are subjected to a range of elevated temperature conditions during the materials lifetime. High-temperature peel strength is an important parameter during pouch manufacture, sterilisation and also in shipping/storage. The proposed method allows the temperature dependence of seal behaviour to be investigated by adapting standard tensile testing equipment. The technique was used to determine the peel strengths of two grades of wax/polymer-type adhesive coated (Tyvek (R)) at elevated temperatures. The peel strength was found to decline with a 50% reduction in peel strength observed between ambient and 43 degrees C. This demonstrates the importance of quantifying the effect of temperature on mechanical behaviour.

Item Type:Journal article
Keywords:medical packaging; high-temperature peel strength; sterilisation; hot tack
Faculties and Schools:Faculty of Computing & Engineering
Faculty of Computing & Engineering > School of Engineering
Research Institutes and Groups:Engineering Research Institute
Engineering Research Institute > Engineering Composites
ID Code:5372
Deposited By:Dr Dorian Dixon
Deposited On:13 Jan 2010 12:57
Last Modified:18 Aug 2011 11:43

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